Production Services:

• Low to mid volume production quantities
• Surface Mount (SMT) production
• Single and double-sided
  component mounting
• Chips to 0402 packages
• Fine pitch to 0.015" (15 mils)
• BGA
• Adhesive application

• Through Hole (TH) production
• Mixed (SMT + TH) production
• Inspection: AOI and manual
• Complete testing
• Conformal coating

• Potting
• Environmental stress screening
• Memory device programming

• Complete box build and test
• Complete system assembly and test
• Cable/harness assembly and test
• Prototype assembly

Assembly Equipment (partial listing):

(click on links to see photos of equipment)

• 2 Contact Systems 3 Series pick and place machines
• HTI H7 stencil printer
• Heller 1500W convection reflow oven
• ADI MP-80 SMT assembly station
• OK industries FCR2000 SMT rework station
• 2 Contact Systems CS-400 TH component locators
• Electrovert Econopak wave solder machine
• Hollis 16" dual wave solder machine
• Wenesco M93 selective solder machine
• Aqueous Technologies SMT 800-LD aqueous cleaner
• Pine solvent-based cleaning system
• 2 Roto Trim lead trimmers
• 3 solder pots
• 3 Hepco lead prep machines
• Eubanks 2600 wire cut/strip machine
• AMP K connector crimp press
• Hollingsworth H270 connector crimp press
• Brady 3481 label maker
• 2 FKN depanelizer machines

Test and Inspection Equipment (partial listing):

• Photon Dynamics AOI system
• 6 Vision Engineering Mantis stereo microscopes
• Vision Engineering Lynx stereo microscope
• Metron Model 16 optical PCB comparator
• Cirris Signature 1000R+ harness cable tester
• 2 Envirotronics SSH32C test chambers
• 10 Burn-in ovens
• Various test equipment: DMM’s, scopes, function generators, RF analyzers, etc.